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基于銅基的多層氮化硼薄膜(52.5cm)

簡要描述:Specifications:
Close to complete coverage (90-95%), with some minor holes
Average Thickness of BN film is 13 nm
Thickness of the copper foil is 20 microns
Quality is confirmed by TEM.

  • 産品型号:
  • 廠商(shāng)性質:生(shēng)産廠家
  • 更新時間:2018-07-03
  • 訪  問  量:896

詳細介紹

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

TEM image of perfect hexagonal structure

AFM image of multilayer BN on Cu

AFM scan of multilayer BN on Cu

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